 |
| |
 特點： |
1.適用於切割混凝土、瀝青等材質之物品。
2.以雷射器溶接，無論乾式加工、濕式加工都可使用！
3.擁有加長之10mm的刀刃以增長使用壽命, 避免使用時鉅片本體迅速磨耗;配合使用切削能力極佳的結合劑以強
化其切削能力！
|
| |
| 鉅片尺寸： |
|
|
|
 |
|
|
 |
| |
| |
| Features : |
1. Diamond abrasives are bonded to the surface of piano wire.
2. May produce wire of 100 kilometers in length to the maximum, which is 3 to 10 times as long as by
loose abrasive method.
3. Improved working conditions by means of using dissoluble cutting fluid.
4. Improved environment protection by separate collection of chip from other wastes.
|
| |
| Applications : |
 |
Semi-conductor and silicone for solar battery. |
|
Brittle material such as crystal, glass, quartz and ceramics. |
|
Magnetic material. |
|
Other materials that are hard to be cut, and various substrates. |
|
|
 |
|
|
|
|
 |
| |
| |
| Features : |
1.由於使用沒有結合劑的CVD厚膜鑽石，因此擁有如同單結晶鑽石般的超強耐磨耗性。
2.由於本身為多結晶體，因此沒有單結晶鑽石中常見的異方位性，也不會因為使用方向的不同而產生性能方
面的變化。
3.由於使用角柱型鑽石，其作用面積一定，並能維持安定的性能。
4.不需要再研磨，也不需要支出多餘的修理管理成本。
5.可以藉由變更角柱鑽石的大小及排列個數來獲得最佳的研磨性能。 |
| |
| Application : |
(1)研削砂輪(軸承)
(2)一般砂輪
(3)天然單結晶修整輪 |
|
 |
|
| ............................................................................................................................................................................................... |
|
|
|
|
