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| Improved wear resistance of dot print wires and probe pins in semiconductor inspection. |
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| Featuring high-temperature-resistant materials with small thermal expansion coefficients; utilized expansively in high-temperature furnaces, electrical and semiconductor industries. |
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| Material with high thermal conductivity that can adequately adjust the thermal expansion coefficient to work properly with other peripheral components; applied largely in microwave appliances, plastic package and substrates for power transistors etc. |
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| Featuring low thermal expansion coefficients similar to those of silicon; utilized as underlying metals of semiconductor devices, and heat sinks of LSI and IC chips. |
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